Please use the following address for all conference related questions and correspondence:
IEEE SOC Conference
19803 Laurel Valley Place
Montgomery Village, MD 20866
Phone: +1 (301) 527-0900 x104
Fax: +1 (301) 527-0994
Email: info@ieee-socc.org
For questions on technical issues you may also contact the appropriate chairpersons below.
Organizing Committee - Steering Committee - Track Chairs - Program Committee

Organizing Committee:
Steering Committee:
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Steering Committee Chair
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Suhwan Kim
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Seoul National University, Korea
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s.kim@ieee-socc.org
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Steering Committee Past Chair
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2008 General Chair
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2008 Technical Program Chair
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Ram Krishnamurthy
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Thanh Tran
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Thomas Büchner
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Intel Corporation
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Texas Instruments
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IBM
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r.krishnamurthy@ieee-socc.org
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t.tran@ieee-socc.org
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t.buechner@ieee-socc.org
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2008 Technical Program Co-Chair
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Steering Committee Member
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Steering Committee Member
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Andrew Marshall
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Wei Hwang
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Dong Ha
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Texas Instruments
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National Chiao Tung University
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Virginia Tech
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a.marshall@ieee-socc.org
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w.hwang@ieee-socc.org
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d.ha@ieee-socc.org
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Steering Committee Member
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Steering Committee Member
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Steering Committee Member
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John Chickanosky
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P. R. Mukund
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Ramalingam Sridhar
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IBM
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Rochester Institute of Technology
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SUNY at Buffalo
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j.chickanosky@ieee-socc.org
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pr.mukund@ieee-socc.org
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r.sridhar@ieee-socc.org
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Track Chairs / Co-Chairs
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1. Analog, Mixed-Signal and RF Circuits and Systems
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2. Embedded Systems, Multi/Many Core Systems, and Embedded Memory Technologies
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Hongjiang Song
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Gin-Kou Ma
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Koushik Das
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Norbert Schuhmann
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Intel Corporation
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Industrial Technology Research Institute, Taiwan
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IBM
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Fraunhofer IIS
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h.song@ieee-socc.org
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gk.ma@ieee-socc.org
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k.das@ieee-socc.org
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n.schuhmann@ieee-socc.org
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3. Low-Power Circuits, Systems, and Design Methodologies
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4. Signal Integrity, Design for Testability, and Design Verification
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Sanu Mathew
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Yong-Bin Kim
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Radu Secareanu
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Danella Zhao
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Intel Corporation
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Northeastern University
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Freescale
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University of Louisiana, Lafayette
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s.mathew@ieee-socc.org
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yb.kim@ieee-socc.org
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r.secareanu@ieee-socc.org
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d.zhao@ieee-socc.org
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5. Video and Multimedia Processing Circuits and System
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6. Digital Signal Processing (DSP) Circuits and Systems
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Nagi Naganathan
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Ken Hsu
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Ken Hsu
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Nagi Naganathan
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LSI Corp.
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Rochester Institute of Technology
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Rochester Institute of Technology
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LSI Corp.
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n.naganathan@ieee-socc.org
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k.hsu@ieee-socc.org
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k.hsu@ieee-socc.org
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n.naganathan@ieee-socc.org
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7. Network on Chip (NoC) & Interconnects
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8. System Level Design Methodology, EDA and Design Tools for SoC
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Sao-Jie Chen
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Maurizio Palesi
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Emrah Acar
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Kaijian Shi
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National Taiwan University
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University of Catania, Italy
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IBM
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Synopsys
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sj.chen@ieee-socc.org
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m.palesi@ieee-socc.org
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e.acar@ieee-socc.org
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k.shi@ieee-socc.org
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9. Reconfigurable and Programmable Circuits and Systems, System on Programmable Devices (FPGAs)
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10. Wireline & Wireless Communication Circuits and Systems
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Jürgen Becker
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Tughrul Arslan
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Mark Schrader
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Gerd Ascheid
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University of Karlsruhe
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University of Edinburgh
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Harris
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Aachen University of Technology
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j.becker@ieee-socc.org
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t.arslan@ieee-socc.org
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m.schrader@ieee-socc.org
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g.ascheid@ieee-socc.org
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11. NEMS/MEMS Devices, Nano-technology and Design Methodologies
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Fabrizio Lombardi
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Darrin Young
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Northeastern University
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Case Western Reserve University
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f.lombardi@ieee-socc.org
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d.young@ieee-socc.org
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Follow this link to the list of the Technical Program Committee

We thank Cherrice Traver from the Department of Electrical Engineering at Union College, Schenectady, NY,
for hosting the ASIC’94-ASIC/SOC’02 pages